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High-frequency spindles for wafer dicing
High-frequency spindles for wafer dicing

High-frequency spindles for wafer dicing

Description

  • The electric spindle for cutting is supported by pneumatic bearing with small vibration, stable rotation and reliable performance. The contact signal between the blade and the silicon wafer is taken out by the carbon brush for machine control. The exhaust gas is discharged by the muffler, which reduces the exhaust noise; it has three water jets, and the front end is connected to the nozzle to cool and rinse the blade.

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High-frequency spindles for wafer dicing

    • ZYS high-frequency spindles for wafer dicing use air static pressure bearings, and the wafer scriber spindles have high precision, low vibration, steady rotation and reliable performance.

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